4th floor,C building , High-tech International Innovation Center, Kelian Road, Yutang Street, Guangming New District, Shenzhen

SMT (Surface Mount Technology)

Elevating Creativity Through Premium Print and Design Services.

High-Speed SMT for Complex PCBA Assembly

We support high-density surface mount with precise placement of 01005, QFN, BGA, LGA, and other fine-pitch components—ideal for medical, telecom, and IoT applications.

We specialize in high-speed surface mount technology capable of handling ultra-fine components such as 01005, QFN, BGA, LGA, and other tight-pitch packages. With precision placement systems operating at up to ±0.025mm accuracy, we ensure reliable and repeatable mounting even in densely populated and miniaturized PCB layouts.

Our production lines are optimized for complex, multi-layer circuit boards commonly used in medical equipment, telecom systems, industrial automation, and IoT edge devices. We support fine-pitch soldering, high-density double-sided mounting, and mixed-technology assemblies with strict process control to minimize defects.

To further ensure quality, we incorporate in-line solder paste inspection (SPI), automatic optical inspection (AOI), and real-time production monitoring to detect and resolve anomalies at every stage.

Whether you require high-mix low-volume projects, pilot runs, or scalable mass production for advanced electronics, our SMT capabilities deliver the speed, precision, and quality assurance needed to meet today’s demanding product requirements.

Consistent Quality from Prototype to Mass Production

Whether you’re building 5 pieces or 50,000, we maintain strict process consistency across every stage of production. Our SMT lines are fully automated and follow standardized procedures, ensuring repeatable results regardless of volume.

Prototype boards are assembled using the same equipment, reflow profiles, and quality control steps as full-scale batches. This eliminates performance gaps between samples and production units, reducing rework risk and accelerating time-to-market.

We strictly follow IPC-A-610 Class 2 and Class 3 standards, depending on your product’s application, and enforce uniform process parameters to deliver stable, high-quality results from the first board to the last.

High precision mounting of tiny components

Advanced chip equipment with ±0.025mm positioning accuracy, effectively avoid problems such as monument, offset, to ensure the reliability of ultra-small package components.

Pick-and-Place Machine

Laser Alignment System

AOI Camera / Vision System

High-Speed Feeder System

SMT+ plug-in mixing process is completed in one stop

Support SMT patch and DIP plug-in hybrid assembly, one-stop completion of the whole board processing, eliminating the coordination of multiple factories, improve delivery and supporting efficiency.

We provide complete SMT and DIP mixed assembly services under one roof—eliminating the need to split production across multiple factories. From high-speed surface-mount placement to manual through-hole insertion and wave soldering, we manage the entire workflow with seamless internal coordination and quality control.

This integration not only reduces lead time and logistics costs but also improves production traceability and minimizes communication errors. By processing all boards in the same facility, we ensure consistent assembly quality, synchronized process control, and unified documentation from start to finish.

Whether your design involves large power components, precision connectors, transformers, or any combination of SMD and THT parts, our hybrid production lines are equipped to handle complex assemblies with speed, accuracy, and reliability—making us an ideal partner for industrial, automotive, and consumer-grade electronics.

Achieve high precision welding of PCBA welded circuit board to ensure the quality of each solder joint

Achieving high-precision soldering is critical for ensuring the quality and longevity of every solder joint in PCBA production. To meet the strictest standards, we use advanced soldering technologies such as automated reflow soldering, selective soldering, and laser soldering. These precision methods ensure each component is securely attached to the board with consistent accuracy, minimizing risks like cold solder joints, solder bridging, and defects that could compromise performance.

Our process includes strict parameter control, adjusting soldering temperatures, times, and flux application to maintain optimal conditions for each solder joint. We also use automated inspection systems and visual checks by experts to detect flaws. Additionally, we perform rigorous post-production testing, including electrical continuity and mechanical stress tests, to validate each solder joint’s performance and reliability.

By combining cutting-edge technology with skilled craftsmanship, we guarantee each PCBA achieves the highest precision and stable performance under various conditions. Our commitment ensures flawless performance even in the most demanding applications.

Source of Raw Materials for PCBA Manufacturing

Raw MaterialSourceDescription
CopperMines (Global, e.g., Chile, Peru)Used for copper traces and pads on the PCB, often sourced from major copper-producing countries.
Fiberglass (FR4)Petrochemical Industry (Global)FR4 is the most common PCB substrate, made from woven fiberglass and resin, sourced globally.
Solder PasteTin, Lead, Silver, Copper (Global)A mixture of tin, lead, and other metals, sourced from mining operations globally, used for component soldering.
Resin (Epoxy)Petrochemical Industry (Global)Used for PCB laminates and coatings, typically derived from petrochemical sources worldwide.
GoldMines (Global, e.g., South Africa, China)Used for high-quality PCB surface finishes, particularly for connectors and pads.
TinMines (Global, e.g., Indonesia, Bolivia)Used in solder and for surface finishes, often sourced from tin mines in Southeast Asia and South America.
NickelMines (Global, e.g., Russia, Canada)Used for plating and surface finishes, sourced globally from nickel-rich mining regions.
SilverMines (Global, e.g., Mexico, Peru)Used in solder paste and for specialized finishes, sourced from silver mining regions.
AluminumMines (Global, e.g., Australia, China)Used for certain PCB substrates and heat dissipation, especially for LED and power electronics.
Tin/Lead SolderTin and Lead Mines (Global)Traditional alloy for soldering, though lead-free alternatives are increasingly used.
SiliconSemiconductor Industry (Global)Essential for integrated circuits (ICs), sourced from silicon mining and refining industries.
PlasticPetrochemical Industry (Global)Used for packaging and insulation in PCBs, often sourced from global plastic manufacturers.

 

Solder paste SPI+AOI full inspection to avoid error shipment

Solder paste printing is tested using SPI before the patch, and solder joints/components are tested using AOI after the patch, ensuring that each board is fully inspected before leaving the factory

To ensure zero-defect delivery, we implement 100% in-line inspection before and after placement. Before SMT begins, our solder paste inspection (SPI) system checks pad coverage, volume, height, and alignment—preventing print-related failures early in the process.

After reflow soldering, all boards are scanned using AOI (Automated Optical Inspection) to detect issues such as missing components, polarity errors, tombstoning, solder bridging, and cold joints. High-resolution cameras and intelligent algorithms ensure fast and accurate defect detection.

Unlike sampling methods, we inspect every board during production—enabling real-time quality control, early defect correction, and data traceability. This comprehensive approach significantly reduces returns, rework, and customer complaints—giving you peace of mind with every shipment.

Manufacturing Equipment

Our manufacturing facilities are equipped with state-of-the-art technology, ensuring precision and efficiency in every stage of the PCBA production process. With automated equipment and strict quality control measures, we can meet large-scale production demands while offering customized solutions, guaranteeing product reliability and high performance.