High-layer PCBA manufacturing with tight process control and reliable stack-up quality for complex, high-performance applications.
We are equipped with advanced multilayer PCBA manufacturing capabilities, supporting 2 to 50 layers. Our facility handles complex board architectures with high-density interconnections, high-speed signals, and high-power load requirements. From HDI designs to large-format power boards, we meet a wide range of structural and performance demands with precision.
Through precise lamination, accurate layer registration, and strict process control, we ensure high reliability in every stack-up. Challenges such as layer misalignment, via deformation, and interlayer connection instability are effectively addressed during production. We apply advanced drilling technology—including laser and mechanical drilling—and tightly controlled dielectric spacing to maintain structural and electrical consistency across all layers.
Our process includes full in-process inspection, X-ray alignment verification, and AOI checks to detect internal and external defects early. By maintaining stable process parameters, real-time monitoring, and using high-performance base materials, we ensure every high-layer board meets rigorous performance and durability standards—reducing defect rates, minimizing rework, and enabling a smooth transition from prototyping to volume production.
We employ advanced photolithography and precision etching techniques to achieve ultra-fine trace widths and spacing down to 2.5 mil (63.5μm), meeting the demands of today’s high-speed and high-frequency PCB designs. Our process supports complex layouts such as differential pairs, controlled impedance traces, and dense via structures essential for 5G, HDI, RF, and high-speed digital applications.
Maintaining signal integrity begins at the fabrication level. We implement tight process controls on copper thickness, dielectric consistency, trace edge definition, and uniform etching across the panel. These controls minimize the effects of crosstalk, signal reflections, and impedance mismatch—common issues that degrade electrical performance in high-speed circuits.
Our fabrication line supports materials with low-loss characteristics and high-frequency laminates, including Rogers, Isola, and Taconic, to further enhance signal performance. Combined with rigorous in-process inspections and final testing, we ensure that every board delivers consistent, stable signal transmission across all layers.
Tailored PCBA thickness and copper weight to meet high-current, high-strength, and thermal performance demands across various applications.
We support PCB thickness from 0.1mm to 10mm to meet diverse structural and mechanical needs, ensuring strong board rigidity and fit across different product types and uses.
Finished copper thickness is available up to 12oz to handle high current loads, providing strong conductivity, enhanced durability, and improved thermal performance.
Our boards are ideal for high-current and high-temperature applications. Proper copper weight and insulation reduce overheating risks and improve long-term stability.
Thick copper layers and sturdy base materials eliminate risks like trace burnout and deformation, ensuring higher reliability in power supply and industrial designs.
We use only certified high-grade materials like FR4, high-Tg, and ceramics to ensure board reliability, thermal stability, and consistent production quality.
We implement a rigorous material control system to ensure that every PCB we manufacture begins with a solid and reliable foundation. Only high-grade materials are used, including standard FR4, high-Tg laminates for enhanced heat resistance, and ceramic substrates for specialized applications requiring superior thermal conductivity and dimensional stability.
Each material batch is carefully verified upon arrival—checking for physical integrity, manufacturer certification, and compliance with IPC, RoHS, and other relevant industry standards. All materials are fully traceable throughout the production cycle, with batch codes logged and monitored to guarantee consistency across orders.
We reject the use of low-quality or substitute materials that can lead to warping, delamination, poor thermal performance, or reduced product lifespan. Our approach ensures that the mechanical, thermal, and electrical properties of the board remain stable in demanding environments.
By maintaining strict control over base materials, we not only minimize rework and failure rates, but also significantly reduce long-term maintenance costs for our customers—ensuring every board we produce stands up to real-world use with reliability and durability.
Support for SMT, DIP, single and double-sided assembly, and various surface finishes—enabling flexible production and one-stop delivery for diverse product designs
| Quality Control Aspect | Description | Key Benefits |
|---|---|---|
| Incoming Material Inspection | All raw materials are thoroughly inspected before production to ensure they meet industry standards. | Ensures the highest quality foundation for PCBs. |
| Automated Optical Inspection (AOI) | Continuous monitoring of the production line with AOI to detect defects in the soldering process and component placement. | Maximizes accuracy, minimizes defects, and increases production efficiency. |
| X-ray Inspection | X-ray inspection is used to inspect internal connections and detect hidden soldering or assembly defects. | Detects hidden defects and ensures the reliability of multi-layer PCBs. |
| Functional Testing | Comprehensive testing of all functional aspects of the PCBs, including electrical performance and signal integrity. | Ensures that the final product performs to specifications and guarantees reliability. |
| Environmental Stress Testing | PCBs undergo tests under extreme temperature, humidity, and vibration conditions to simulate real-world stresses. | Verifies PCB durability under challenging conditions, such as in aerospace and military applications. |
| Final Visual Inspection | A detailed final inspection by experts ensures that all PCBs meet the strictest standards before shipping. | Prevents any cosmetic or minor defects from reaching the customer. |
| Statistical Process Control (SPC) | Utilizes data-driven analysis to monitor and control the production process for consistency. | Ensures ongoing consistency and high-quality output throughout production. |
Ensured stability and uniformity from the first board to full-scale production through automated lines and multi-stage process monitoring systems.
Our fully automated production lines are built to ensure that every PCBA—from the first prototype to full-volume orders—meets the same high standard of quality and performance. We eliminate variability through strict process control, standardized workflows, and real-time monitoring systems across each step of the production chain.
Each board passes through a unified set of machines, with consistent placement, soldering, and inspection procedures. From SMT and reflow soldering to AOI and functional testing, every process is calibrated to maintain repeatability and accuracy.
This level of consistency solves common issues like prototype-pass but batch-fail scenarios, unstable solder quality, and inconsistent yields. By ensuring tight quality uniformity, we improve delivery reliability and help our customers maintain product integrity in the hands of end users.
Whether your project requires hundreds or hundreds of thousands of units, our production system is designed to scale—without compromising consistency.
We support PCB manufacturing from 2 to 50 layers, including HDI and multilayer stack-ups with blind and buried vias.
Yes, we offer full-service support—from quick-turn prototypes (as fast as 24–72 hours) to stable, large-scale mass production with consistent quality control.
We offer a variety of finishes including ENIG (gold), HASL (lead and lead-free), OSP, immersion tin, and hard gold to meet different application needs.
All boards go through 100% electrical testing and AOI inspection. For complex projects, we use both flying probe and test jigs to verify functionality and stability.
Absolutely. We support FR4, high-Tg, ceramic substrates, aluminum-backed boards, and custom stack-up designs. Tell us your requirements—we’ll provide a tailored solution.
We implement a rigorous inspection process to ensure that every PCB delivered is defect-free and ready for deployment. Before shipment, 100% of our boards undergo both electrical testing and Automated Optical Inspection (AOI), leaving no room for missed errors.
For electrical testing, we utilize both flying probe testers and customized test fixtures depending on the project complexity and volume. This dual-layer testing approach validates critical parameters such as continuity, isolation, impedance, and signal path functionality. It helps eliminate risks such as open circuits, shorts, or marginal connections that may cause failures in the field.
Our AOI systems use high-resolution optical cameras and intelligent image comparison to detect micro-level defects, including solder bridges, missing components, polarity errors, and misalignment—issues often invisible to the naked eye. These inspections are integrated at multiple stages, including post-SMT and post-reflow, ensuring that defects are caught early and eliminated before final assembly.
With over 40 years experience in the industry. We know a thing or two about PCB manufacturing.
If you can’t find what you are looking for, please don’t hesitate to get in touch directly.
Simply fill in the form and we will try to get back to you ASAP. Alternatively, you can call or email us on the details below.
long@custompcba.com
+86 18123721954
4th floor,C building , High-tech International Innovation Center, Kelian Road, Yutang Street, Guangming New District, Shenzhen
long@custompcba.com
+86 18123721954
