4th floor,C building , High-tech International Innovation Center, Kelian Road, Yutang Street, Guangming New District, Shenzhen

SMT PCB Assembly Service

Surface mount technology (SMT) is a key means to achieve automated PCB assembly. Instead of the traditional manual operation of inserting component pins through holes, it enables automated production by inputting design files into the pick and place machine. This technology not only improves product reliability and consistency, but also speeds up the production cycle.

In the SMT PCB assembly process, a structured chain process is adopted. The bare board is first picked up and placed, then surface-mounted and reflow welded to form a complete PCBA board. In the field of modern electronic assembly, SMT technology occupies an important position because the distance between the component and the PCB has a significant impact on signal transmission. SMT assembly enables the use of leadless or short-lead components (SMC/SMD).

If your electronics project is looking for SMT PCBA services in China, be sure to contact FS Technology for a more competitive quote.

We are a Chinese PCBA supplier committed to providing high-quality SMT assembly services to customers around the world. Our factory has 7 fully automated SMT production lines and is equipped with the most advanced equipment to meet every need from prototyping to mass production.

As electronics become increasingly complex, we understand the importance of turnkey solutions. Our engineering team works closely with you during the design phase to optimize circuit layout and cost according to your project needs. In addition, to ensure the accuracy of the final product, FS technology implements strict process control throughout the assembly process. This not only improves the quality and speed of production, but also maintains the reputation of our factory, achieving a real win-win situation.

Capacity: Our factory is equipped with 7 fully automated production lines, with a monthly output of 52 million pieces (0.15 seconds per piece, 0.7 seconds per QFP).
Specifications: We are able to handle board sizes ranging from 0.25 “x0.25” to 680 x 500 mm, with component sizes covering 0201 to 54 square millimeters (0.084 square inches). We offer a wide range of component options, including long connectors, 0201 packages, CSP, BGA and QFP.
Assembly methods: We support single-sided, double-sided, rigid, flexible and rigid and flexible assembly methods.
Equipment: Our equipment includes solder paste printers, SPI detectors, automatic solder paste printers, 10-zone reflow soldering, AOI, X-ray and baking machines.
Certification: We have received several certifications, including ISO13485, ISO 9001, IATF16949, ISO 14001 and ISO 45001.
Special Services: We offer special services such as design upgrades, parts procurement, expedited project handling and after-sales service.
Industry applications: Our services cover a wide range of industries, including healthcare, aviation, automotive, Internet of Things and consumer electronics.

ODM Service

One-stop circuit board customization, sample production, whole process management and quality assurance services

Custom design service

Provide personalized board design, tailored to customer needs, to ensure the best function and performance.

Rapid sample

Complete sample production in a short time to help customers quickly verify the design and accelerate the product market process.

Process management

From design, procurement to production, one-stop management of the whole process to ensure efficient project promotion and quality control.

Quality assurance

Strict testing standards and advanced equipment are adopted to ensure that each circuit board reaches high quality and high reliability.

Our Promises

Professional management

Comprehensive project management, strict manufacturing process and advanced equipment support

Professional Services

From design to delivery, there is a person in charge of managing your project.

Stringent Fabrication Processes

The production line features multiple inspection points and our operators strictly adhere to rigorous quality management regulations to ensure the highest level of quality.

Advanced Equipment

Debarring machine, double-sided alkaline etching machine, metal chemical cleaning machine, etching production line and more.

We have more than 15 employees dedicated to quality control, ensuring effective management and control of key processes. These processes include incoming material inspection, input quality control and output quality control. In addition, we have 5 senior electronics engineers on our team who are constantly proposing improvements to DFM (Design manufacturability) and engineering processes, resulting in improved product quality and overall production efficiency. On the production line, we have implemented electronic information display boards to ensure functional supervision of PMC (Production and Material Control) production plans and delivery times. In order to ensure the safety of our products during transportation, we use electrostatic bags or electrostatic protection foam (PE foam) for packaging.

Step 1: Solder Paste Application

The PCB assembly process involves the use of solder paste to secure components. The first step in surface mount assembly is applying solder paste to precise locations. This process includes spreading solder paste on a PCB stencil and then using a squeegee to allow the solder paste to drop through the holes in the stencil onto the soldering points.

Step 2: Place Components

The entire surface-mount assembly process is automated. Manufacturers are required to provide coordinate files to the equipment for efficient operation. A pick-and-place robot, equipped with vacuum nozzles, is used to select and position components based on the instructions from the coordinate files.

Step 3: SPI Inspection

This stage is dedicated to inspecting the quality of solder paste and surface-mount components. At this point, the solder paste is in a molten state, allowing for immediate adjustments if any issues are identified. Omitting SPI testing at this stage can make rework challenging, as robust solder joints have already been formed during the reflow soldering process.

Step 5: AOI

Due to the high-temperature nature of the soldering process, AOI inspection is conducted after reflow soldering to ensure the quality of the solder joints. AOI equipment uses cameras to scan the surface-mounted PCB board and compares the obtained data with set parameters. If defects are identified, they are marked for rework.

Advantages of SMT technology

In modern electronic circuit boards, the application of surface mount technology (SMT) far exceeds that of through-hole technology (THT). One of the main reasons is that SMT assembly is more suitable for automated production. In contrast, THT may still require human intervention when dealing with large components. The advantage of machine production lies in its indefatigability and its ability to avoid human error.

In addition, surface mount devices (SMDS) are significantly smaller in geometry and volume than dual-in-line package (DIP) components and weigh only one-tenth of the DIP component. This advantage allows the SMT PCBA to be arranged more compact for more efficient use of space.

In terms of circuit performance, SMT technology shortens the distance between the component and the PCB by welding the component directly to the PCB surface without the need to lead through the hole. This not only improves signal transmission performance, but also significantly reduces electrical and thermal noise in the PCB.

SMT assembly service market trends and challenges

The market for surface mount technology (SMT) assembly services has reached $6 billion by 2023 and is expected to continue to grow. By 2035, this figure is expected to exceed $15 billion, with a compound annual growth rate of 7 percent. This strong growth trend is mainly attributed to advances in automation technology, component miniaturization, and increased cost-effectiveness.

In the future, component miniaturization will further reduce the lead spacing, possibly to less than 0.010 inches. To cope with this change, SMT service providers need to further optimize welding technology to prevent damage to the tiny pads from heat.

In addition, environmental problems are getting more and more attention. According to the RoHS Directive, the use of solder containing lead may pose an environmental hazard during assembly. Therefore, manufacturers should adopt lead-free PCB assembly as an alternative to continue to serve the electronics industry while reducing their environmental impact.

Let's get in touch!